distant areas: Static units are typically located remotely, raising Charge and reducing Over-all program performance.
Tool & TCU application calibration processes fluctuate exterior check products not made use of often for verifying
With all the POU3500, you are able to reach unprecedented ends in etch functionality, chamber uptime, decreased cost of possession and fab space utilization – all whilst strengthening your course of action reliability.
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LAUDA-Noah will, for just a client's retrofit evaluation, monitor and modify its fluid temperature Command profiles to match an present TCUs' so as to guarantee a easy method integration via DAQ.
The accuracy of your POU 3300 allows for unbiased control of the process fluid temperature to the wafer chuck within +/- 0.one °C of established level, plus the fast reaction time from the process allows for maximum wafer-to-wafer repeatability through the entire etch process.
The precision with the POU 3500 permits independent Charge of the process fluid temperature into the wafer chuck in just +/- 0.one °C of established place, plus the quick response time of your program enables for maximum wafer-to-wafer repeatability all through the etch process.
Along with the POU3300, it is possible to achieve unprecedented ends in etch overall performance, chamber uptime, lowered price of possession and fab Room utilization – all although enhancing your course of action trustworthiness.
big Footprint: Static models occupy significant Area inside the fabrication tool place, reducing its performance.
Dynamic Temperature Manage, as executed in systems such as LAUDA-Noah POU, is surely an solution that senses the temperature of the method fluid getting back from the procedure chamber’s wafer chuck (ESC) and dynamically adjusts the temperature with the provided process fluid based upon this more info real-time feed-back.
the information established here is from a 200mm volume production wafer fab and clearly illustrates the benefit of the LAUDA-Noah POU process.
The POU3300 procedure delivers dynamic temperature Charge of the process chamber cathode / electrode / anode and may be synchronized with any etch procedure.
The reality is the fact that correct Dynamic Temperature Management can only be reached when all 5 (five) of the following process design and style and set up prerequisites are met:
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